POET Technologies Inc.

in response to PoetryinMotion's message

True, PoetryinMotion. Anyway, if I understood correctly, the brittleness issue is something that has to be taken into account resp. is taken into account during the wafer manufacturing process. Once the chip is sealed in its encasing, brittleness shouldn't be an issue anymore – not even on a deep space probe.

Andrea ("Powered by POET")

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Andrea Koch
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POET Technologies Inc.
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