Article speaks to wafer stacking and new process for bonding that may lower costs when building circuits, with some performance gain enroute to 3D...speaking to a what i think would be a minor part of the semiconductor process.
It appears the writer threw in POET at the end of the article, but it does not mean these companies are on par or doing anything close to what POET has acheived. POET has a full solution using electronicc and optic on the same die using Gaas for 10 x performance gain over equivalenet chips today.
"Stacking technology is just one many components required for the transition to 3D, he said."
Think of the process explained in the article as a new way of welding and combining parts of a V4 150 hp car (3D Nand)...where POET IS a completetly different rocket powered car. Big difference.
