POET Technologies Inc.

It is worth noting that BAE has production for 3 and 6 inch wafers however, I think a lot of what they do is custom/semi-custom. 8 inch is the norm for commercial folks like Samsung, Intel et al. It's a matter of volume, and 8 inch yields more pieces.

As for brittle - I think it is a bit of a red herring. During manufacturing it is TLC all the way. Any yields that test ok are then packaged. Once a chip is packaged into its cermic it is locked in and protected.

IMHO